You must notify us within 30 days of shipment for any returns. If you are dissatisfied with your order for any reason, you can return your items for a prompt refund or exchange. If you discover any concealed (hidden) shipping damage or missing items after opening your shipment, please save the shipping box and call us so that we can file a claim with the freight package service in order to credit you or replace the item. Packages damaged in transit should be refused and not accepted contact us and we will re-ship your order. To request information about shipping to your country, contact us at: All international customs fees, duties, and taxes are the responsibility of the recipient.ĭiscrepancies in shipments should be reported within 3 days of receipt. and North America are subject to special requirements and regulations. Shipments to countries outside of the U.S. Items indicated as qualifying for Select free delivery status apply only to ship locations in the 50 United States. If only some items in your order are eligible for Select Free Shipping, you will pay applicable shipping charges for the ineligible items. Using the right cleaning solution and a clean soft brush the flux and adhesive residue can be cleaned off the package. The package can be air dried using either a static neutralizing gun or with nitrogen.Items eligible for Select Free Shipping will be designated as such on their product pages. A properly-profiled reflow source then attaches the solder ball to the package.Īfter being cooled the EZReball™ preform can be pulled off of the package. The package being reballed sits with the ball side up in order to get the best possible ball attachment. The BGA preforms are then aligned to the package making sure of the proper orientation of the preform to the package. Assuming the lands of the component are already prepped, water soluble paste flux is spread onto the pads of the component. Cleaning solution based on the flux usedĮZReball™ Solder Ball Preform Reballing Process FlowĮZReball™ Solder Ball Preform Reballing PrepĪfter confirming the drawing with the user, the preforms are designed, laser machined and populated with the proper-sized balls along with the proper alloy.which can be engineered and fabricated in a few days at BEST Inc. Each unique solder alloy, ball size and grid pattern requires a new preform. The major advantage of this technique is in its convenience as the solder balls are packaged inside of the preform. After being cooled the reballing preform is simply peeled away. Finally, the part is cleaned and inspected. This aligns the land patterns of the device to the preforms' ball locations. After applying flux to the bottom of the part, the balls and part land patterns are aligned and “squared up” with the device. The key to this method is the engineered polyimide and other polymer-based carrier ("preform") which holds the solder balls in place. This BGA reballing process was developed primarily with the speed of attachment and simplicity in mind. EZREball™The solder EZReball™ preform technique (IPC 7711/21 5.7.5.) used for reballing area array devices is one of the methods used at BEST for the attachment of solder balls.
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